PIC10F200T datasheet(45/86 Pages) MICROCHIP

45 / 86 page

Preliminary

DS41239B-page 43

PIC10F200/202/204/206

TABLE 9-2:

RESET CONDITION FOR SPECIAL REGISTERS

9.3.1

MCLR ENABLE

This configuration bit, when unprogrammed (left in the

‘1’ state), enables the external MCLR function. When

programmed, the MCLR function is tied to the internal

VDD and the pin is assigned to be a I/O. See Figure 9-1.

FIGURE 9-1:

MCLR SELECT

9.4

Power-on Reset (POR)

The PIC10F200/202/204/206 devices incorporate an

on-chip

Power-on

Reset

(POR)

circuitry,

which

provides an internal chip Reset for most power-up

situations.

The on-chip POR circuit holds the chip in Reset until

VDD has reached a high enough level for proper oper-

ation. To take advantage of the internal POR, program

the GP3/MCLR/VPP pin as MCLR and tie through a

resistor to VDD, or program the pin as GP3. An internal

weak pull-up resistor is implemented using a transistor

(refer to Table 12-3 for the pull-up resistor ranges).

This will eliminate external RC components usually

needed to create a Power-on Reset. A maximum rise

time for VDD is specified. See Section 12.0 “Electrical

Characteristics” for details.

When the devices start normal operation (exit the

Reset condition), device operating parameters (volt-

age, frequency, temperature,...) must be met to ensure

operation. If these conditions are not met, the devices

must be held in Reset until the operating parameters

are met.

A simplified block diagram of the on-chip Power-on

Reset circuit is shown in Figure 9-2.

The Power-on Reset circuit and the Device Reset

Timer (see Section 9.5 “Device Reset Timer (DRT)”)

circuit are closely related. On power-up, the Reset latch

is set and the DRT is reset. The DRT timer begins

counting once it detects MCLR to be high. After the

time-out period, which is typically 18 ms, it will reset the

Reset latch and thus end the on-chip Reset signal.

A power-up example where MCLR is held low is shown

in Figure 9-3. VDD is allowed to rise and stabilize before

bringing MCLR high. The chip will actually come out of

Reset TDRT msec after MCLR goes high.

In Figure 9-4, the on-chip Power-on Reset feature is

being used (MCLR and VDD are tied together or the pin

is programmed to be GP3). The VDD is stable before

the Start-up timer times out and there is no problem in

getting a proper Reset. However, Figure 9-5 depicts a

problem situation where VDD rises too slowly. The time

between when the DRT senses that MCLR is high and

when MCLR and VDD actually reach their full value, is

too long. In this situation, when the start-up timer times

out, VDD has not reached the VDD (min) value and the

chip may not function correctly. For such situations, we

recommend that external RC circuits be used to

achieve longer POR delay times (Figure 9-4).

For additional information, refer to Application Notes

AN522 “Power-Up Considerations”, (DS00522) and

AN607 “Power-up Trouble Shooting”, (DS00607).

STATUS Addr: 03h

PCL Addr: 02h

Power-on Reset

00-1 1xxx

1111 1111

MCLR Reset during normal operation

000u uuuu

1111 1111

MCLR Reset during Sleep

0001 0uuu

1111 1111

WDT Reset during Sleep

0000 0uuu

1111 1111

WDT Reset normal operation

0000 uuuu

1111 1111

Wake-up from Sleep on pin change

1001 0uuu

1111 1111

Wake-up from Sleep on comparator change

0101 0uuu

1111 1111

Legend: u = unchanged, x = unknown, – = unimplemented bit, read as ‘0’.

GP3/MCLR/VPP

MCLRE

Internal MCLR

GPWU

Note:

When the devices start normal operation

(exit the Reset condition), device operat-

ing

parameters

(voltage,

frequency,

temperature, etc.) must be met to ensure

operation. If these conditions are not met,

the device must be held in Reset until the

operating conditions are met.

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