HSMX-S660 datasheet(10/11 Pages) HP

Nome de Peças	HSMX-S660

Descrição Electrónicos	High Performance Surface Mount Chip LEDs

PDF	11 Pages

Scroll/Zoom	100%

Fabricante Electrônico	HP [Agilent(Hewlett-Packard)]

Página de início	http://www.home.agilent.com

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10 / 11 page

Figure 14. Tape Leader and Trailer Dimensions.

Figure 13. Tape Dimensions HSMx-S660.

8.00 ± 0.30

(0.315 ± 0.012)

USER FEED

DIRECTION

3.35

(0.15)

3.50 ± 0.05

(0.138 ± 0.002)

1.75 ± 0.10

(0.069 ± 0.004)

1.20

2.0

CATHODE

HOLE

2.3

(0.08)

4.00 ± 0.10

(0.157 ± 0.004)

2.00 ± 0.05

(0.079 ± 0.002)

4.00 ± 0.10

(0.157 ± 0.004)

1.50 + 0.10

(0.059 + 0.004)

CATHODE

(Ø1.1)

CATHODE

HOLE

END

START

THERE SHALL BE A

MINIMUM OF 40 mm

(1.57 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MOUNTED WITH

COMPONENTS

THERE SHALL BE A

MINIMUM OF 40 mm

(1.57 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

150 mm-360 mm

(5.9 - 14.2 INCH)

MAY CONSIST

OF CARRIER

AND/OR

COVER TAPE.

Storage Condition: 5 to 30˚ C @ 60% RH max.

Baking is required under the condition:

a) the blue silica gel indicator becoming white/transparent color

b) the pack has been opened for more than 1 week

Baking recommended condition: 60 +/– 5˚C for 20 hours.

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