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STM32G030C6 Folha de dados(PDF) 91 Page - STMicroelectronics

Nome de Peças STM32G030C6
Descrição Electrónicos  Arm® Cortex®-M0 32-bit MCU, up to 64 KB Flash, 8 KB RAM, 2x USART, timers, ADC, comm. I/Fs, 2.0-3.6V
PDF  94 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
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STM32G030C6 Folha de dados(HTML) 91 Page - STMicroelectronics

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STM32G030x6/x8
91
6.5
Thermal characteristics
The operating junction temperature TJ must never exceed the maximum given in
The maximum junction temperature in °C that the device can reach if respecting the
operating conditions, is:
TJ(max) = TA(max) + PD(max) x ΘJA
where:
•
TA(max) is the maximum operating ambient temperature in °C,
•
ΘJA is the package junction-to-ambient thermal resistance, in °C/W,
•
PD = PINT + PI/O,
–PINT is power dissipation contribution from product of IDD and VDD
–PI/O is power dissipation contribution from output ports where:
PI/O = Σ (VOL × IOL) + Σ ((VDDIO1 – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high
level in the application.
6.5.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (still air). Available from www.jedec.org.
Table 21: General operating conditions
Table 71. Package thermal characteristics
Symbol
Parameter
Package
Value
Unit
Junction-
to-ambient
Junction-
to-board
Junction-
to-case
Θ
Thermal resistance
LQFP48 7 × 7 mm
84
76
42
°C/W
LQFP32 7 × 7 mm
84
76
42
TSSOP20 6.4 × 4.4 mm
88
57
19
SO8N 4.9 × 6 mm
134
86
30



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