MPC8544EBVTARGA datasheet(98/117 Pages) NXP

Nome de Peças	MPC8544EBVTARGA

Descrição Electrónicos	MPC8544E PowerQUICC III Integrated Processor Hardware Specifications

PDF	117 Pages

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Fabricante Electrônico	NXP [NXP Semiconductors]

Página de início	http://www.nxp.com

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MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 8

Freescale Semiconductor

Thermal

Figure 60. System Level Thermal Model for MPC8544E (Not to Scale)

The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer

for flow over the part in standard JEDEC environments, as well as the heat spreading in the board under

the package. In a real system, however, the part will require a heat sink to be mounted on it. In this case,

the predominant heat flow path will be from the die to the heat sink. Grid density lower than currently in

the package library file will suffice for these simulations. The user will need to determine the optimal grid

for their specific case.

Solder and Air (29

× 29 × 0.58 mm)

0.034

W/m•K

0.034

12.1

Table 72. MPC8544EThermal Model (continued)

Conductivity

Value

Units

Bump Underfill

Section A-A

Top View

Die

Substrate

Solder/Air

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