6 Pin Configuration and Functions

Thermal

Pad

1

VM

8

VCC

2

OUT1

3

OUT2

6

IN1

4

GND

5

IN2

7

nSLEEP

Figure 6-1. DRV8210P DSG Package 8-Pin WSON Top View

Table 6-1. Pin Functions

PIN

TYPE

DESCRIPTION

NAME

NO.

GND

4

PWR

Device ground. Connect to system ground.

IN1

6

I

H-bridge control input. See Section 8.3.2. Internal pulldown resistor.

IN2

5

I

H-bridge control input. See Section 8.3.2. Internal pulldown resistor.

nSLEEP

7

I

Sleep mode input. Set this pin to logic high to enable the device. Set this pin to logic low to go to low-

power sleep mode. Internal pulldown resistor.

OUT1

2

O

H-bridge output. Connect to the motor or other load.

OUT2

3

O

H-bridge output. Connect to the motor or other load.

VM

1

PWR

Motor power supply. Bypass this pin to the GND pin with a 0.1-µF ceramic capacitor as well as sufficient

Bulk Capacitance rated for VM.

VCC

8

PWR

Logic power supply. Bypass this pin to the GND pin with a 0.1-µF ceramic capacitor rated for VCC.

PAD

—

—

Thermal pad. Connect to system ground.

DRV8210P

SLVSFG4 – DECEMBER 2020

www.ti.com

4

Submit Document Feedback

Copyright © 2020 Texas Instruments Incorporated

Product Folder Links: DRV8210P