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R200 Folha de dados(PDF) 40 Page - Intel Corporation

Nome de Peças R200
Descrição Electrónicos  Embedded Infrared Assisted Stereovision 3D Imaging System with Color Camera
PDF  51 Pages
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Fabricante Electrônico  INTEL [Intel Corporation]
Página de início  http://www.intel.com
Logo INTEL - Intel Corporation

R200 Folha de dados(HTML) 40 Page - Intel Corporation

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System Integration
40
334616-001
Deviation from these properties is allowed, but the compatibility with the
R200 receptacle must be maintained. Longer cable lengths is allowed, but
signal integrity should be evaluated by the system integrator.
Table 7-11. Cable Assembly Interconnect Properties
Pos
R200
System
Gauge
Interconnect Description
1
GND
GND
40
50Ω micro-coax, shield soldered to GND
bar.
2
USB3_SSTX-
USB3_SSTX-
40
50Ω micro-coax, shield soldered to GND
bar.
3
USB3_SSTX+
USB3_SSTX+
40
50Ω micro-coax, shield soldered to GND
bar.
4
GND
GND
40
50Ω micro-coax, shield soldered to GND
bar.
5
USB3_SSRX-
USB3_SSRX-
40
50Ω micro-coax, shield soldered to GND
bar.
6
USB3_SSRX+
USB3_SSRX+
40
50Ω micro-coax, shield soldered to GND
bar.
7
GND
GND
36
UL 10064 Wire (Rated at least 0.3A.)
8
No Connect
No Connect
-
No Connect
9
VCC
5V
36
UL 10064 Wire (Rated at least 0.3A.)
10
VCC
5V
36
UL 10064 Wire (Rated at least 0.3A.)
The TX to RX pair crossover is expected on the system board and not the
cable assembly. This is done to allow for flat cable assemblies.
§ §



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