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IP4856CX25/C Folha de dados(PDF) 18 Page - Nexperia B.V. All rights reserved

Nome de Peças IP4856CX25/C
Descrição Electrónicos  SD 3.0-compliant memory card integrated dual voltage level translator with EMI filter and ESD protection
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Product data sheet
Rev. 2 — 15 October 2014
17 of 21
NXP Semiconductors
IP4856CX25/C
SD 3.0-compliant memory card integrated dual voltage level translator
16. Abbreviations
Table 17.
Reflow soldering process characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Treflow(peak) peak reflow temperature
230
-
260
C
t1
time 1
soak time
60
-
180
s
t2
time 2
time during T
 250 C
--30
s
t3
time 3
time during T
 230 C10
-
50
s
t4
time 4
time during T > 217
C
30
-
150
s
t5
time 5
-
-
540
s
dT/dt
rate of change of
temperature
cooling rate
-
-
6
C/s
preheat
2.5
-
4.0
C/s
Table 18.
Abbreviations
Acronym
Description
DUT
Device Under Test
EMI
ElectroMagnetic Interference
ESD
ElectroStatic Discharge
FR4
Flame Retard 4
MMC
MultiMedia Card
NSMD
Non-Solder Mask PCB Design
OSP
Organic Solderability Preservation
PCB
Printed-Circuit Board
RoHS
Restriction of Hazardous Substances
SD
Secure Digital
WLCSP
Wafer-Level Chip-Scale Package



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