Suggested Soldering Temperature Profile

Recom m ended reflow m ethods: IR, vapor phase oven, hot air oven, wave solder.

The device can be exposed to a m axim um tem perature of 265°C for 10 seconds.

Devices can be cleaned using standard industry m ethods and solvents.

If reflow temperatures exceed the recom m ended profile, devices m ay not m eet the

p erfo rm a nce re q uire m e nts.

Note

Package Information

Carrier Dimension(mm)

A0

B0

K0

D0

6.90

4.0

8.60

12.0

1.65

2.0

1.55

0.30

1.75

16

E

F

7.50

P0

P1

P2

T

W

0.1

Tolerance

Package Specifications

Package Reel Size

Q'TY/Reel

Box Size

MSBL

13'

3

338

6

QTY/Box

Carton Size

365*365*360

Reel DIA.

330

(mm)

(Kpcs)

Q'TY/Carton

48

(mm)

(mm)

(Kpcs)

(Kpcs)

MSB601~MSB607

Version 1.1

2018/2/27

http://www.bytesonic.com

.tw/