ADP5072ACBZ-R7 datasheet(5/24 Pages) AD

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Data Sheet

ADP5072

Rev. 0 | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

PVIN, AVIN

−0.3 V to +6V

SW1

−0.3 V to +40 V

SW2

PVIN − 40 V to PVIN + 0.3 V

PGND, AGND

−0.3 V to +0.3 V

EN1, EN2, FB1, FB2, SYNC,

−0.3 V to +6 V

COMP1, COMP2, SLEW, SS,

SEQ, VREF

−0.3 V to AVIN + 0.3 V

Operating Junction

Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance. ψJT is the junction to

case thermal characterization parameter.

Table 4. Thermal Resistance

Package Type

θJA

θJC

ΨJT

Unit

CB-20-141, 2

0.54

0.13

C/W

θJA and ΨJT are based on a 4-layer printed circuit board (PCB) (two signal and

two power planes) with nine thermal vias connecting the exposed pad to the

ground plane as recommended in the Layout Considerations section. θJC is

measured at the top of the package and is independent of the PCB. The ΨJT

value is more appropriate for calculating junction to case temperature in the

application.

The thermal resistance values specified in Table 4 are simulated based on

JEDEC specifications, unless specified otherwise, and must be used in

compliance with JESD51-12.

ESD CAUTION

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