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GD9FS1G8F2AMG Folha de dados(PDF) 48 Page - GigaDevice Semiconductor (Beijing) Inc.

Nome de Peças GD9FS1G8F2AMG
Descrição Electrónicos  Single level cell technology
PDF  55 Pages
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Fabricante Electrônico  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
Página de início  http://www.gigadevice.com/
Logo GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD9FS1G8F2AMG Folha de dados(HTML) 48 Page - GigaDevice Semiconductor (Beijing) Inc.

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48
Dimensions
Symbol
A
A1
A2
b
D
Hd
E
E1
e
L
L1
θ
Unit
mm
Min
-
0.05
0.90
0.14
18.30
19.80
11.90
-
0.50
0.425
0.60
0
Nom
-
0.10
1.00
0.22
18.40
20.00
12.00
-
0.525
0.80
-
Max
1.20
0.15
1.10
0.30
18.50
20.20
12.10
12.40
0.625
1.00
7
Note：
1.
Tolerance of the dimension should be ±0.1 unless otherwise specified.
2.
Corner radius should be less than ±0.1R unless otherwise specified (excluding outer lead).
3.
Tolerance of the angles should be ±0.5 degree unless otherwise specified.
4.
The mold surface should have a finish 8±2S without luster.
Trace of knockout pin and the ahaded portion of detail “A” should be polish surface.
5.
Discrepancies between upper and lower molding cavity should be less than 0.05 of the package.
6.
Mold flash should be less than 0.2mm.



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