Os motores de busca de Datasheet de Componentes eletrônicos
  Portuguese  ▼
ALLDATASHEETPT.COM

X  

SSM2517CBZ-R7 Folha de dados(PDF) 6 Page - Analog Devices

Nome de Peças SSM2517CBZ-R7
Descrição Electrónicos  PDM Digital Input, Mono 2.4 W Class-D Audio Amplifier
PDF  16 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricante Electrônico  AD [Analog Devices]
Página de início  http://www.analog.com
Logo AD - Analog Devices

SSM2517CBZ-R7 Folha de dados(HTML) 6 Page - Analog Devices

Back Button SSM2517CBZ-R7 Datasheet HTML 2Page - Analog Devices SSM2517CBZ-R7 Datasheet HTML 3Page - Analog Devices SSM2517CBZ-R7 Datasheet HTML 4Page - Analog Devices SSM2517CBZ-R7 Datasheet HTML 5Page - Analog Devices SSM2517CBZ-R7 Datasheet HTML 6Page - Analog Devices SSM2517CBZ-R7 Datasheet HTML 7Page - Analog Devices SSM2517CBZ-R7 Datasheet HTML 8Page - Analog Devices SSM2517CBZ-R7 Datasheet HTML 9Page - Analog Devices SSM2517CBZ-R7 Datasheet HTML 10Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 6 / 16 page
background image
SSM2517
Data Sheet
Rev. B | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
PVDD Supply Voltage
−0.3 V to +6 V
VDD Supply Voltage
−0.3 V to +3.6 V
Input Voltage (Signal Source)
−0.3 V to +3.6 V
ESD Susceptibility
4 kV
OUT− and OUT+ Pins
8 kV
Storage Temperature Range
−65°C to +150°C
Operating Temperature Range
−40°C to +85°C
Junction Temperature Range
−65°C to +165°C
Lead Temperature (Soldering, 60 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Junction-to-air thermal resistance (θJA) is specified for the worst-
case conditions, that is, a device soldered in a printed circuit board
(PCB) for surface-mount packages. θJA and θJB (junction-to-board
thermal resistance) are determined according to JEDEC JESD51-9
on a 4-layer PCB with natural convection cooling.
Table 5. Thermal Resistance
Package Type
PCB
θJA
θJB
Unit
9-Ball, 1.5 mm × 1.5 mm WLCSP
1S0P
162
39
°C/W
2S0P
76
21
°C/W
ESD CAUTION



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16


Folha de dados Download

Go To PDF Page


Ligação URL



ALLDATASHEET é útil para você?  [ DONATE ] 

Sobre Alldatasheet   |   Publicidade   |   Contato conosco   |   Privacy Policy   |   Link para a ficha técnica    |   roca de Link   |   Lista de Fabricantes
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com