– 9 –

CXG1109EN

Sony Corporation

0.05

SONY CODE

EIAJ CODE

JEDEC CODE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

COPPER ALLOY

PACKAGE STRUCTURE

TERMINAL SECTION

Soldrer Plating

0.14

ranges of 0.1mm and 0.25mm from the end of a terminal.

NOTE:1) The dimensions of the terminal section apply to the

16PIN VSON (PLASTIC)

VSON-16P-01

0.02 g

0.2 S B

A

3.5

0.4

B

0.2 S

B

A

0.05 M S A-B

2x

4x

S

S

0.9 MAX

0.6

0.13 ± 0.025

+ 0.09

– 0.03

1.4

0.35 ± 0.1

Package Outline

Unit: mm

LEAD PLATING SPECIFICATIONS

ITEM

LEAD MATERIAL

COPPER ALLOY

SOLDER COMPOSITION

Sn-Bi Bi:1-4wt%

PLATING THICKNESS

5-18µm

SPEC.

0.05

SONY CODE

EIAJ CODE

JEDEC CODE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

COPPER ALLOY

PACKAGE STRUCTURE

TERMINAL SECTION

Soldrer Plating

0.14

ranges of 0.1mm and 0.25mm from the end of a terminal.

NOTE:1) The dimensions of the terminal section apply to the

16PIN VSON (PLASTIC)

VSON-16P-01

0.02 g

0.2 S B

A

3.5

0.4

B

0.2 S

B

A

0.05 M S A-B

2x

4x

S

S

0.9 MAX

0.6

0.13 ± 0.025

+ 0.09

– 0.03

1.4

0.35 ± 0.1

Kokubu Ass’y