LTC6955

21

Rev 0

For more information www.analog.com

Preliminary Technical Data

Advance Product Information Subject to Change

Rev PrA

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog

Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications

subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

PACKAGE DESCRIPTION

UKG Package

52-Lead Plastic QFN (7mm × 8mm)

(Reference LTC DWG # 05-08-1729 Rev Ø)

7.00

±0.10

(2 SIDES)

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 TOP MARK

(SEE NOTE 6)

PIN 1 NOTCH

R = 0.30 TYP OR

0.35

× 45°C

CHAMFER

0.40

±0.10

52

51

1

2

BOTTOM VIEW—EXPOSED PAD

TOP VIEW

SIDE VIEW

6.50 REF

(2 SIDES)

8.00

±0.10

(2 SIDES)

5.50 REF

(2 SIDES)

0.75

±0.05

0.75

±0.05

R = 0.115

TYP

R = 0.10

TYP

0.25

±0.05

0.50 BSC

0.200 REF

0.00 – 0.05

6.45

±0.10

5.41

±0.10

0.00 – 0.05

(UKG52) QFN REV Ø 0306

5.50 REF

(2 SIDES)

5.41

±0.05

6.45

±0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70

±0.05

6.10

±0.05

7.50

±0.05

6.50 REF

(2 SIDES)

7.10

±0.05 8.50 ±0.05

0.25

±0.05

0.50 BSC

PACKAGE OUTLINE

×