TPS61372 datasheet(2/35 Pages) TI1

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TPS61372

SLVSEE7 – JUNE 2018

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Table of Contents

Features .................................................................. 1

Applications ........................................................... 1

Description ............................................................. 1

Revision History..................................................... 2

Device Comparison Table..................................... 3

Pin Configuration and Functions ......................... 3

Specifications......................................................... 4

7.1

Absolute Maximum Ratings ...................................... 4

7.2

ESD Ratings ............................................................ 4

7.3

Recommended Operating Conditions ....................... 4

7.4

Thermal Information .................................................. 5

7.5

Electrical Characteristics........................................... 5

7.6

Switching Characteristics .......................................... 7

7.7

Typical Characteristics .............................................. 8

Detailed Description ............................................ 10

8.1

Overview ................................................................. 10

8.2

Functional Block Diagram ....................................... 10

8.3

Feature Description................................................. 11

8.4

Device Functional Modes........................................ 11

8.5

Device Behavior Description ................................... 12

Application and Implementation ........................ 17

9.1

Application Information............................................ 17

9.2

Typical Application ................................................. 17

Power Supply Recommendations ..................... 25

Layout................................................................... 25

11.1

Layout Guidelines ................................................. 25

11.2

Layout Example .................................................... 26

11.3

Thermal Consideration.......................................... 27

Device and Documentation Support ................. 27

12.1

Device Support .................................................... 27

12.2

Trademarks ........................................................... 27

12.3

Electrostatic Discharge Caution ............................ 27

12.4

Glossary ................................................................ 27

Mechanical, Packaging, and Orderable

Information ........................................................... 27

13.1

Package Option Addendum .................................. 28

4 Revision History

DATE

REVISION

NOTES

June 2018

Advance Information release.

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