B3S-1102P pdf, B3S-1102P Descrição Electrónicos, B3S-1102P Folha de dados, B3S-1102P view ::: ALLDATASHEET :::

Nome de Peças	B3S-1102P

Descrição Electrónicos	Surface Mount Tactile Switch for High-Density Packaging

Tamanho do Arquivo	230.24 Kbytes

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Fabricante Electrônico	OMRON [Omron Electronics LLC]

Página de início	http://www.omron.com/index3.html

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Nº de peça semelhante - B3S-1102P

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
Omron Electronics LLC	B3S-1102P	49Kb / 5P	Mechanical Key Switch (SMD)
	B3S-1102P	278Kb / 4P	Tactile Switch
	B3S-1102P	244Kb / 3P	Sealed Tactile Switch (SMT)
	B3S-1102P	189Kb / 3P	Sealed construction conforming to IP67 (IEC-60529) provides high contact reliability in locations exposed to dust or water

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
Hirose Electric	HP5-189P-1.27W	1Mb / 34P	High-density Packaging System
List of Unclassifed Man...	1619-1	493Kb / 1P	Space saving design for high density packaging
Vishay Siliconix	SS2P3-M3	87Kb / 4P	High Current Density Surface Mount High Current Density Surface Mount 02-Aug-13
CTS Corporation	752161102G	233Kb / 4P	High Density Packaging
	753081103GP	189Kb / 4P	High Density Packaging
	753	189Kb / 4P	High Density Packaging
Raltron Electronics Cor...	RT3215	133Kb / 1P	IDEAL FOR HIGH DENSITY PACKAGING APPLICATION
Copal Electronics	SMT1	576Kb / 2P	Surface Mount Tactile Switches
Copal Electronics	SMT3	676Kb / 2P	Surface Mount Tactile Switches
World Produts Inc.	PCMP384	324Kb / 26P	Small dimension for high density packaging