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0879371206 Folha de dados (PDF) - Molex Electronics Ltd.

Nome de Peças	0879371206

Descrição Electrónicos	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 12 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height

Tamanho do Arquivo	102.98 Kbytes

Html View	1 2 3

Fabricante Electrônico	MOLEX10 [Molex Electronics Ltd.]

Página de início	http://www.molex.com

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0879371206 Folha de dados (PDF) - Molex Electronics Ltd.

Nº de peça semelhante - 0879371206

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
Molex Electronics Ltd.	0879371600	195Kb / 4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25關m (10關) Gold(Au) Selective Plating, 17.63mm (.694) Stacking Height
Molex Electronics Ltd.	0879371601	195Kb / 4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25關m (10關) Gold(Au) Selective Plating, 19.05mm (.750) Stacking Height

Descrição semelhante - 0879371206

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
Molex Electronics Ltd.	0879370406	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 4 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879370502	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 5 Circuits, 2.50關m (100關") Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0878910606	770Kb / 10P	2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0878914006	770Kb / 10P	2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0877970040	196Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54關m (100關) Tin (Sn) Plating, 14.22mm (.560) Stacking Height
	0879370106	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 1 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0879370802	102Kb / 3P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
	0878910106	770Kb / 10P	2.54mm (.100) Pitch KK짰 Header, Through Hole, Vertical, 1 Circuit, 2.50 關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0878910306	770Kb / 10P	2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879370800	194Kb / 4P	2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50關m (100關) Tin (Sn) Plating, 12.00mm (.472) Stacking Height

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