Features
• All devices are 100% surge tested.
• Low capacitance of 100 pF or less
• 3σ (sigma) lot norm screening performed on standby current (ID) for all M prefix devices
• Molding compound flammability rating: UL94V-O
• Unidirectional versions available only
• Two different terminations available in C-bend (modified J-bend with DO-214AB) or Gullwing (DO-215AB)
• Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B for all M prefix devices
• Suppress transients up to 1,500W at 10/1000 μs (see Figure 4-1)
• Enhanced reliability screening options with M prefix are available in reference to MILPR
19500. Refer to High Reliability Non-Hermetic Products Portfolio for more details on
the screening options.
(See Part Nomenclature for all available options.)
• RoHS compliant versions available
• Axial-lead equivalent packages for thru-hole mounting are available as MLCE6.5 to
MLCE170Ae3 with 1500W rating (contact Microchip for other surface mount options.)

Applications/Benefits
• Available in working stand-off voltage range of 6.5 to 170V
• Low capacitance for high frequency data line protection to 1 MHz
• Protection for aircraft fast data rate lines up to level 5 waveform 4 and level 2 waveform 5A in RTCA/DO-160G
(also see MicroNote 130) and ARINC 429 with bit rates of 100 kb/s (per ARINC 429, Part 1, par 2.4.1.1)
• IEC61000-4-2 ESD 15 kV (air), 8 kV (contact)
• IEC61000-4-5 (lightning) as further detailed in LCE6.5 thru LCE170A data sheet
• T1/E1 line cards
• Base stations, WAN and XDSL interfaces
• CSU/DSU equipment