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CFP15 Folha de dados (PDF) - Amkor Technology

CFP15 Datasheet PDF - Amkor Technology
Nome de Peças CFP15
Download  CFP15 Download
Tamanho do Arquivo   593.78 Kbytes
página   2 Pages
Fabricante Electrônico  AMKOR [Amkor Technology]
Página de início  http://www.amkor.com
Logo AMKOR - Amkor Technology
Descrição Electrónicos The PSMC package is part of the FLAT series of compact surface mount packages which allow miniaturization.

CFP15 Datasheet (PDF)

Go To PDF Page Download Folha de dados
CFP15 Datasheet PDF - Amkor Technology

Nome de Peças CFP15
Download  CFP15 Click to download

Tamanho do Arquivo   593.78 Kbytes
página   2 Pages
Fabricante Electrônico  AMKOR [Amkor Technology]
Página de início  http://www.amkor.com
Logo AMKOR - Amkor Technology
Descrição Electrónicos The PSMC package is part of the FLAT series of compact surface mount packages which allow miniaturization.

CFP15 Folha de dados (HTML) - Amkor Technology


CFP15 Detalhes do produto

FEATURES
Cu connector structure to reduce inductance and resistance
Enhanced thermal properties
Turnkey with test and packing services
Green materials: Pb-free plating & halogen-free mold compound

Application
With both 2 and 3 lead versions available, the PSMC package is suitable for high‑efficiency diode as well as transistor applications.
Schottky Barrier Diodes (SBDs)
Rectifier & Zener Diodes
Transient Voltage Suppressors (TVS)
MOSFETs




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Sobre a Amkor Technology


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Esta informação é apenas para fins informativos gerais, não seremos responsáveis por qualquer perda ou dano causado pelas informações acima.




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