Features
 Surface mount bridge, small package;
 Ideal for printed circuit boards;
 Glass passivated chip junction;
 High forward current capability up to 8.0A;
 High surge current capability;
 High heat dissipation capability;
 Low profile package;
 Low forward voltage drop;
 Plastic package has Underwrites LaboratoryFlammability Classification 94V-0
 This is a Pb − Free Device
 All SMC parts are traceable to the wafer lot
 Additional testing can be offered upon request

Mechanical Data
 Case: HBS;
 Epoxy meets UL-94V-0 Flammability rating;
 Terminals:Matte tin plated leads, solderableper
J-STD-002 and JESD22-B102;
 High temperature soldering guaranteed:
Solder Reflow 260℃,10seconds;
 Polarity: As marked on body;
 Marking: Type number;