This device uses the Schottky Barrier principle with a large area
metal−to−silicon power diode. Ideally suited for low voltage, high
frequency rectification or as free wheeling and polarity protection
diodes in surface mount applications where compact size and weight
are critical to the system. This package also provides an easy to work
with alternative to leadless 34 package style. Because of its small size,
it is ideal for use in portable and battery powered products such as
cellular and cordless phones, chargers, notebook computers, printers,
PDAs and PCMCIA cards. Typical applications are AC−DC and
DC−DC converters, reverse battery protection, and “Oring” of
multiple supply voltages and any other application where performance
and size are critical.
Features
 Guardring for Stress Protection
 Low Forward Voltage
 125C Operating Junction Temperature
 Epoxy Meets UL 94 V−0 @ 0.125 in
 Package Designed for Optimal Automated Board Assembly
 ESD Rating:
 Human Body Model = 3B
 Machine Model = C
 NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics
 Device Marking: L2L
 Polarity Designator: Cathode Band
 Weight: 11.7 mg (approximately)
 Case: Epoxy, Molded
 Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
 Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds