| Fabricante Electrônico | Nome de Peças | Folha de dados | Descrição Electrónicos |
 Teledyne Technologies I... |
256
|
1Mb/3P |
MAGNETIC-LATCHING DPDT HALF-SIZE CRYSTAL CAN MILITARY RELAY
|
 3M Electronics |
256
|
564Kb/5P |
3M??Scotch짰 Printable Flatback Paper Tape 256
|
 Aries Electronics, Inc. |
256
|
653Kb/2P |
PGA ZIF Test & Burn-in Socket for Any Footprint on Std 8x8 to 21x21 Grid
Rev. 1.10 |
 Walther-Werke |
256
|
437Kb/4P |
Channel installation sockets IP 44
|
 List of Unclassifed Man... |
256-30695-131
|
235Kb/1P |
Connectors for Copper Conductor
|
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256-30695-1351
|
235Kb/1P |
Connectors for Copper Conductor
|
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256-30695-1352
|
235Kb/1P |
Connectors for Copper Conductor
|
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256-30695-1361
|
235Kb/1P |
Connectors for Copper Conductor
|
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256-30695-1362
|
235Kb/1P |
Connectors for Copper Conductor
|
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256-30695-1383
|
235Kb/1P |
Connectors for Copper Conductor
|
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256-30695-233
|
235Kb/1P |
Connectors for Copper Conductor
|
|
256-30695-263
|
235Kb/1P |
Connectors for Copper Conductor
|
|
256-30695-264
|
235Kb/1P |
Connectors for Copper Conductor
|
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256-30695-282
|
235Kb/1P |
Connectors for Copper Conductor
|
|
256-30695-422
|
235Kb/1P |
Connectors for Copper Conductor
|
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256-30695-424
|
235Kb/1P |
Connectors for Copper Conductor
|
 Hynix Semiconductor |
256-FBGA
|
1Mb/136P |
32-bit ARM7TDMI RISC static CMOS CPU core
|
 Aries Electronics, Inc. |
256-PLS12X12-12
|
841Kb/2P |
ZIF PGA Test & Burn-in Socket for Any Footprint on Std 13x13 to 21x21 Grid
|
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256-PLS12X12-16
|
841Kb/2P |
ZIF PGA Test & Burn-in Socket for Any Footprint on Std 13x13 to 21x21 Grid
|
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256-PLS13X13-12
|
841Kb/2P |
ZIF PGA Test & Burn-in Socket for Any Footprint on Std 13x13 to 21x21 Grid
|