THS7530

SLOS405A DECEMBER 2002– REVISED APRIL 2003

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2

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate

precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to

damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGING/ORDERING INFORMATION

PRODUCT

PACKAGE

PACKAGE

DESIGNATOR

SYMBOL

TEMPERATURE

RANGE, TA

ORDERING

NUMBER

TRANSPORT

MEDIA

THS7530

TSSOP PowerPAD

PWP 14

THS7530

40

°Cto85°C

THS7530PWP

Tube

THS7530

TSSOP PowerPAD

PWP-14

THS7530

–40

°C to 85°C

THS7530PWPR

Tape and reel

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

THS7530

Supply voltage, VS+ – Vs–

5.5 V

Input voltage, VI

±VS

Output current, IO (2)

65 mA

Differential input voltage, VID

±4 V

Continuous power dissipation

See Dissipation Rating Table

Maximum junction temperature, TJ

150

°C

Maximum junction temperature for long term stability, TJ

125

°C

Operating free-air temperature range, TA

–40

°C to 85°C

Storage temperature range, Tstg

–65

°C to 150°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

°C

HBM

3000 V

ESD

CDM

1500 V

ESD

MM

200 V

(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The THS7530 incorporates a PowerPAD

 on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipative

plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage

the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the PowerPAD thermally enhanced package.

RECOMMENDED OPERATING CONDITIONS

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Supply voltage, [VS– to VS+]

4.5

5

5.5

V

Operating free–air temperature, TA

–40

85

°C

Input common mode voltage

[VS– to VS+] = 5 V

2.5

V

Output common mode voltage

[VS– to VS+] = 5 V

2.5

V

PACKAGE THERMAL DATA

PACKAGE

PCB

ΘJA

( C/W)

ΘJC

( C/W)

TA = 25°C

POWER RATING

14PWP

See Layout Considerations in the application

section of this data sheet.

37.5

2.07

3 W

PowerPAD is a trademark of Texas Instruments.