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DCT OR DCU PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

1CLK

1D

2Q

GND

1Q

2D

2CLK

4

3

2

1

5

6

7

8

GND

2Q

1D

1CLK

2CLK

2D

1Q

YEP OR YZP PACKAGE

(BOTTOM VIEW)

DESCRIPTION/ORDERING INFORMATION

SN74LVC2G80

DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

SCES309C – DECEMBER 2001 – REVISED JUNE 2005

•

Available in the Texas Instruments

NanoStar™ and NanoFree™ Packages

•

•

Inputs Accept Voltages to 5.5 V

•

•

Low Power Consumption, 10-

µA Max I

CC

•

•

•

Mode Operation

•

Latch-Up Performance Exceeds 100 mA

Per JESD 78, Class II

•

ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the

positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the

rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting

the levels at the outputs.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

SN74LVC2G80YEPR

0.23-mm Large Bump – YEP

Tape and reel

_ _ _CX_

NanoFree™ – WCSP (DSBGA)

SN74LVC2G80YZPR

–40°C to 85°C

0.23-mm Large Bump – YZP (Pb-free)

SSOP – DCT

Tape and reel

SN74LVC2G80DCTR

C80_ _ _

VSSOP – DCU

Tape and reel

SN74LVC2G80DCUR

C80_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

⋅ = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2001–2005, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.