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MB86064 Folha de dados(PDF) 1 Page - fujitsu semiconductor

Nome de Peças MB86064
Descrição Electrónicos  Dual 14-bit 1GSa/s DAC
PDF  4 Pages
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Fabricante Electrônico  FUJITSU [fujitsu semiconductor]
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MB86064
Copyright © 2004 Fujitsu Microelectronics Europe GmbH
Production
Page 1 of 4
Disclaimer: The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before
ordering.The information and circuit diagrams in this document are presented “as is”, no license is granted by implication or otherwise.
Product Flyer
October 2004
Version 1.1
FME/MS/DAC80/FL/5085
Dual 14-bit 1GSa/s DAC
Mixed Signal Division
The Fujitsu MB86064 is a Dual 14-bit 1GSa/s digital to analog
converter (DAC), delivering exceptional dynamic performance.
Each high performance DAC core is capable of generating
multi-standard, multi-carrier communication transmit signals,
suitable for 2, 2.5 and 3G systems. DAC data is input via two
high-speed LVDS ports. These operate in a pseudo double data
rate (DDR) mode, with data latched on both rising and falling
edges. Alternatively, the device can be configured as a
multiplexed
dual-port
single
DAC.
To
simplify
system
integration the DAC operates from a clock running at half the
DAC conversion rate.
Features
• Dual 14-bit, 1GSa/s Digital to Analog conversion
• Exceptional dynamic performance
74dBc ACLR for 4 UMTS carriers @ 276MHz direct-IF
• 100MHz image-free generated bandwidth capability
supports UMTS plus digital pre-distortion bandwidth
• Proprietary performance enhancement features
• LVDS data interface
• Register selectable on-chip LVDS termination resistors
• Fujitsu 4-wire serial control interface
• Two 16k point programmable on-chip waveform memories
• Low power 3.3V analog and 1.8V digital operation
• 750mW per DAC power dissipation at 1GSa/s
• 0.18µm CMOS technology with Triple Well
• Performance enhanced EFBGA package
• Industrial temperature range (-40°C to +85°C)
Applications
• Multi-carrier, Multi-standard cellular infrastructure
CDMA, W-CDMA, GSM/EDGE, UMTS
• Wideband communications systems
• High Direct-IF architectures
• Arbitrary waveform generation
• Test equipment
• Radar, video & display systems
PLASTIC PACKAGE
EFBGA-120
Package Dimensions
12 mm x 12 mm
PIN ASSIGNMENT
Not to scale. Viewed from above.
E3
E1
F4
F2
G3
G1
H4
H2
J3
J1
K4
K2
L3
L1
M4
M2
N3
N1
P4
P2
R3
R1
T4
T2
U3
V2
W3
W1
AA5
AC5
Y6
AB6
AA7
AC7
Y8
AB8
AA9
AC9
Y10
AB10
AA11
AC11
Y12
AB12
AA13
AC13
Y14
AB14
AA15
AC15
Y16
AB16
AA17
AC17
Y18
AB18
AA19
AC19
W21
W23
V20
V22
U21
U23
T20
T22
R21
R23
P20
P22
N21
N23
M20
M22
L21
L23
K20
K22
J21
J23
H20
H22
G21
G23
F20
F22
E21
E23
C19
A19
D18
B18
C17
A17
B16
D16
A15
C15
B14
D14
A13
C13
B12
D12
A11
C11
B10
D10
A9
C9
B8
A7
C7
D8
B6
D6
A5
C5
Index
N10
N12
N14
R10
R12
R14
L10
L12
L14
J10
J12
J14
K9
K11
K13
K15
M9
M11
M13
M15
P9
P11
P13
P15
X_A10
A10
DVSS
DVDD
DVDD
DVSS
A8
A6
X_A8
X_A6
A2
X_A2
A4
DVDD
X_B9
DVSS
X_A4
B9
X_B10
B10
DVDD
DVSS
DVDD
DVSS
DVDD
DVSS
X_A3
A3
A1
NC
X_A1
DVSS
NC
A5
X_A5
A7
X_A7
DVDD
A9
X_A9
B6
X_B6
B8
X_B8
B2
X_B2
X_B3
B1
B3
DVDD
X_B4
B5
NC
X_B1
DVSS
B4
X_B5
B7
X_B7
NC
U1
V4
All centre pins : TG


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