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ASL920 Folha de dados(PDF) 17 Page - Advanced Semiconductor Business Inc. |
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ASL920 Folha de dados(HTML) 17 Page - Advanced Semiconductor Business Inc. |
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17 / 18 page ![]() 17/18 ASB Inc. sales@asb.co.kr March 2017 ASL920 8. Package Outline (TSSOP24) 9. Surface Mount Recommendation (In mm) Symbols Dimensions (In mm) MIN NOM MAX A --- --- 1.15 A1 0.00 ---- 0.10 A2 0.80 1.00 1.05 B 0.19 --- 0.30 C 0.09 --- 0.20 D 7.70 7.80 7.90 D1 4.086 4.286 4.486 E 6.20 6.40 6.60 E1 4.30 4.40 4.50 E2 2.55 2.75 2.95 e --- 0.65 --- L 0.45 0.60 0.75 y --- --- 0.10 0 --- 8 L1-L1 --- --- 0.12 L1 1.00REF Lot No. Part No. 0.76 2.20 0.34 1.55 3.42 NOTE 1. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 2. To ensure reliable operation, device ground paddle-to-ground pad soldering is critical. Recommended is that thermal grease used for better thermal performance. 3. Add mounting screws near the part to fasten the board to a heat sinker. Ensure that the ground & thermal via region contacts the heat sinker. 4. A proper heat dissipation path underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can result from inappropriate heat dissipation. |
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