Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

“Soft-PGS (Compressible Type)” PGS with low thermal resistance

Pressure (kPa)

100

0

200

300

400

500

700

600

0

10

20

30

40

50

60

Pressure (kPa)

100

0

200

300

400

500

600

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

a

b

c

✽

Part numbers listed above are all standard samples for your consideration.

✽✽ Contact us for custom-made samples.

We can make samples in various forms and/or dimensions other than standard samples.

Typical values, not guaranteed.

Thermal resistance and compressibility

Items

Test method

Condition

Data

Thickness (

µm)

200

Thermal resistance (K·cm

TIM Tester

600 kPa

0.2

Compressibility (%)

TIM Tester

600 kPa

40

Thermal conductivity (W/m·K)

Laser PIT

X-Y

400 (300 to 600)

Z

(28)

Operating temperature range (°C)

−55 to 400

Type

Sheet only

S Type

Process for IGBT mounting

−

Structure

Front

Side

Operating

Temperature Range

−55 to 400 °C

Thickness: c

200 μm

Standard

Part No.

90

× 90 mm

EYGS0909ZLX2

90

×180 mm

EYGS0918ZLX2

180

×180 mm

EYGS1818ZLX2

Typical characteristics

Lamination type/Composition example

Mar. 2017

03