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PACDN045YB6R-R Folha de dados(PDF) 3 Page - ON Semiconductor

Nome de Peças PACDN045YB6R-R
Descrição Electrónicos  Transient Voltage Suppressors
PDF  14 Pages
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Fabricante Electrônico  ONSEMI [ON Semiconductor]
Página de início  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

PACDN045YB6R-R Folha de dados(HTML) 3 Page - ON Semiconductor

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PACDN042
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3
Table 1. PIN DESCRIPTIONS
Pins
Name
Description
(Refer to Package Outline Drawings)
TVS Cathode
The cathode of the respective TVS diode, which should be connected to the
node requiring transient voltage protection.
(Refer to Package Outline Drawings)
GND
The anode of the TVS diodes.
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
Storage Temperature Range
−65 to +150
°C
Package Power Dissipation
SC70
SOT23−3, SOT23−5, SOT23−6, SOT−143
TSSOP, MSOP
0.2
0.225
0.5
W
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Rating
Units
Operating Temperature
−40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
Symbol
Parameter
Conditions
Min
Typ
Max
Units
C
Capacitance
TA = 25°C, 2.5 VDC, 1 MHz
30
pF
VRSO
Reverse Stand−off Voltage
IR = 10 mA, TA = 25°C
5.5
V
IR = 1 mA, TA = 25°C
6.1
V
ILEAK
Leakage Current
VIN = 5.0 VDC, TA = 25°C
1
100
nA
VSIG
Small Signal Clamp Voltage
Positive Clamp
Negative Clamp
I = 10 mA, TA = 25°C
I = −10 mA, TA = 25°C
6.2
−0.4
6.8
−0.8
8
−1.2
V
VESD
ESD Withstand Voltage
Human Body Model, MIL−STD−883,
Method 3015
Contact Discharge per IEC 61000−4−2
Standard
(Note 1)
(Note 1)
±30
±20
kV
RD
Diode Dynamic Resistance
Forward Conduction
Reverse Conduction
1.0
1.4
W
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. ESD voltage applied between channel pins & ground, one pin at a time; all other channel pins open; all GND pins grounded.



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