TLRH156P

2002-09-25

2

Precaution

Please be careful of the followings

· Soldering temperature: 260°Cmax Soldering time: 3s max

(Soldering portion of lead: Up to 2mm from the body of the device)

· If the lead is formed, the lead should be formed up to 5mm from the body of the device without forming stress to

the resin. Soldering should be performed after lead forming.

· This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure

that it will not be affected by this IR light.