SPC564A80L7 datasheet(144/157 Pages) STMICROELECTRONICS

Nome de Peças	SPC564A80L7

Descrição Electrónicos	Up to 4 multiply and accumulate operations per cycle

PDF	157 Pages

Scroll/Zoom	100%

Fabricante Electrônico	STMICROELECTRONICS [STMicroelectronics]

Página de início	http://www.st.com

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144 / 157 page

Packages

SPC564A74L7, SPC564A80B4, SPC564A80L7

144/157

Doc ID 15399 Rev 9

Table 54.

PBGA324 package mechanical data

Symbol

inches

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A(1),(2),(3)

Max mounted height is 1.77mm.Based on 0.35mm ball pad diameter. Solder paste is 0.15mm thickness

and 0.35mm diameter.

PBGA stands for Plastic Ball Grid Array.

The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metallized

markings, or other feature of package body or integral heatslug. A distinguishing feature is allowable on the

bottom surface of the package to identify the terminal A1corner. Exact shape of each corner is optional.

1.720

1.620

1.720

1.820

0.270

0.350

0.400

0.450

1.320

0.550

0.6000

0.650

0.550

0.600

0.650

22.80

23.00

23.200

22.900

23.000

23.100

21.00

21.000

22.800

23.000

23.200

22.900

23.000

23.100

21.000

0.950

1.000

1.050

0.950

1.000

1.050

0.875

1.000

1.125

0.875

1.000

1.125

ddd

0.200

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