DocID025995 Rev 1

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GG25L

Package information

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Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 15. Flip Chip CSP 1.40 x 2.04 mm package mechanical drawing

1. The terminal A1 on the bump side is identified by a distinguishing feature - for instance, by a circular “clear

area” typically 0.1 mm in diameter and/or a missing bump.

2. The terminal A1, on the back side, is identified by a distinguishing feature - for instance, by a circular “clear