ADF4007BCP datasheet(13/16 Pages) AD

13 / 16 page

ADF4007

Rev. 0 | Page 13 of 16

PCB DESIGN GUIDELINES FOR CHIP SCALE PACKAGE

The lands on the chip scale package (CP-20) are rectangular.

The printed circuit board pad for these should be 0.1 mm

longer than the package land length and 0.05 mm wider than

the package land width. The land should be centered on the pad

to ensure that the solder joint size is maximized.

The bottom of the chip scale package has a central thermal pad.

The thermal pad on the printed circuit board should be at least

as large as this exposed pad. The printed circuit board should

have a clearance of at least 0.25 mm between the thermal pad

and the inner edges of the pad pattern to ensure that shorting is

avoided.

Thermal vias may be used on the printed circuit board thermal

pad to improve thermal performance of the package. If vias are

used, they should be incorporated in the thermal pad at 1.2 mm

pitch grid. The via diameter should be between 0.30 mm and

0.33 mm, and the via barrel should be plated with 1 oz. copper

to plug the via.

The user should connect the printed circuit board thermal pad

to AGND.

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