Thermoelectric Module

Americas: +1 888.246.9050

Europe: +46.31.704.67.57

Asia: +86.755.2714.1166

clv.customerpos@lairdtech.com

www.lairdtech.com

SUFFIX THICKNESS

FLATNESS &

PARALLELISM

HOT FACE COLD FACE LEAD LENGTH

TA

0.112” +/- 0.001”

0.001” / 0.001”

Lapped

Lapped

6.0”

TB

0.112” +/- 0.0005”

0.0005” / 0.0005” Lapped

Lapped

6.0”

FEATURES

• High heat pump density

• Precise temperature control

• Reliable solid state operation

• No sound or vibration

• DC operation

• RoHS compliant

APPLICATIONS

• Analytical instrumentation

• Clinical diagnostics

• Photonics laser systems

• Electronic enclosure cooling

• Food and beverage cooling

• Chillers (liquid cooling)

assembled with a large number of semiconductor couples to achieve a higher heat pumping capacity

than standard single stage TEMs.

This product line is available in multiple configurations and is ideal for applications that require higher

cooling capacities with limited surface area. Assembled with Bismuth Telluride semiconductor material

current and larger heat-pumping applications.

PERFORMANCE SPECIFICATIONS

Hot side temperature (°C)

25

50

Qmax (watts)

126.2

138.6

Delta Tmax (°C)

67

75

Imax (amps)

14.7

14.7

Vmax (volts)

14.5

16.4

Module resistance (ohms)

0.91

1.03

SUFFIX SEALANT

COLOR

TEMP RANGE DESCRIPTION

RT

RTV

White

-60 to 204 °C

Non-corrosive, silicone adhesive sealant

EP

Epoxy

Black

-55 to 150 °C

Low density syntactic foam epoxy encapsulant

SEALING OPTION