LM759 datasheet(6/14 Pages) NSC

6 / 14 page

Typ

Max

Typ

Max

Package

iJC

iJA

Plastic Package (P)

Metal Can (H)

120

150

PD Max e

TJ Max b TA

iJC a iCA

TJ Max b TA

iJA

(without a heat sink)

iCA e iCS a iSA

Solving TJ

TJ e TA a PD (iJC a iCA)or

TA a PDiJA (without a heat sink)

Where

Junction Temperature

Ambient Temperature

Power Dissipation

iJA e Junction to ambient thermal resistance

iJC e Junction to case thermal resistance

iCA e Case to ambient thermal resistance

iCS e Case to heat sink thermal resistance

iSA e Heat sink to ambient thermal resistance

Mounting Hints

Metal Can Package (LM759CHLM759MH)

The LM759 in the 8-Lead TO-99 metal can package must

be used with a heat sink With g15V power supplies the

LM759 can dissipate up to 540 mW in its quiescent (no

load) state This would result in a 100 C rise in chip temper-

ature to 125 C (assuming a 25 C ambient temperature) In

order to avoid this problem it is advisable to use either a slip

on or stud mount heat sink with this package If a stud

mount heat sink is used it may be necessary to use insulat-

ing washers between the stud and the chassis because the

case of the LM759 is internally connected to the negative

power supply terminal

Plastic Package (LM759CPLM77000CP)

The LM759CP and LM77000CP are designed to be at-

tached by the tab to a heat sink This heat sink can be either

one of the many heat sinks which are commercially avail-

able a piece of metal such as the equipment chassis or a

suitable amount of copper foil as on a double sided PC

board The important thing to remember is that the negative

power supply connection to the op amp must be made

through the tab Furthermore adequate heat sinking must

be provided to keep the chip temperature below 125 C un-

der worst case load and ambient temperature conditions

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