ADA4177-2ARZ-R7 datasheet(7/31 Pages) AD

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Data Sheet

ADA4177-1/ADA4177-2/ADA4177-4

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

Supply Voltage

36 V

Input Voltage

SY ± 32 V

Differential Input Voltage

±V

Output Short-Circuit Duration to GND

See the Maximum Power

Dissipation section

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +125°C

Junction Temperature Range

−65°C to +150°C

Lead Temperature, Soldering (10 sec)1

300°C

ESD

Human Body Model (HBM)2

4 kV

Field Induced Charged Device

Model (FICDM)3

1250 V

Machine Model (MM)

200 V

1 IPC/JEDEC J-STS-020D applicable standard.

2 ESDA/JEDEC JS-001-2011 applicable standard.

3 JESD22-C101 (ESD FICDM standard of JEDEC) applicable standard.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

MAXIMUM POWER DISSIPATION

The ADA4177-1, ADA4177-2, and ADA4177-4 can drive a

short-circuit output current of up to 65 mA. However, the

usable output load current drive is limited by the maximum

power dissipation allowed by the device package. The absolute

maximum junction temperature is 150°C (see Table 4). The

junction temperature can be estimated as follows:

TJ = PD × θJA + TA

where:

TJ is the die junction temperature.

PD is the power dissipated in the package.

θJA is the thermal resistance of the package.

TA is the ambient temperature.

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated by the

output stage transistor. It is calculated as follows:

PD = (VSY × ISY) + (VSY − VOUT) × ILOAD

where:

VSY is the power supply rail.

ISY is the quiescent current.

VOUT is the output of the amplifier.

ILOAD is the output load.

Do not exceed the 150°C maximum junction temperature for

the device. Exceeding the junction temperature limit can cause

degradation in the parametric performance or even destroy the

device. Refer to Technical Article MS-2251, Data Sheet Intricacies—

Absolute Maximum Ratings and Thermal Resistances, for more

information.

THERMAL RESISTANCE

Thermal resistance between junction and ambient (θJA) is

specified for the worst-case conditions, that is, a device soldered

in a circuit board for surface-mount packages.

Table 5. Thermal Resistance

Package Type

Unit

8-Lead MSOP

190

°C/W

8-Lead SOIC

158

°C/W

14-Lead TSSOP

240

°C/W

14-Lead SOIC

115

°C/W

ESD CAUTION

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