ADP2360ACPZ-5.0-R7 datasheet(6/16 Pages) AD

6 / 16 page

Data Sheet

ADP2360

Rev. 0 | Page 5 of 15

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, EN, PG, to AGND, PGND

−0.3 V to +61 V

FB to AGND, PGND

−0.3 V to +5.5 V

SW to AGND, PGND

−0.3 V to VIN + 0.3 V

ITH, SS to AGND, PGND

−0.3 V to +4 V

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

–65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

For additional information on thermal resistance, refer to

Application Note AN-000, Thermal Characteristics of IC

Assembly.

Table 3. Thermal Resistance

Package Type

θJA

ΨJB

Unit

8-Lead LFCSP

62.7

33.60

°C/W

θJA and ΨJB and are modeled using a standard 4-layer JEDEC printed

circuit board (PCB) (2S2P) with the exposed pad soldered to

the board with a 2 × 2 array of thermal vias and still air.

ESD CAUTION

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