E

D

0.8000

0.8000

b

X

Y

A

A

A1

DETAIL A

SCALE 12 : 1

0.02 Z

0.20 Z

Z

Dimensions are in millimeters.

1.

Interpret dimensions and tolerances per ASME Y14.5M-1994.

2.

Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.

3.

Datum Z (seating plane) is defined by the spherical crowns of the solder balls.

4.

Parallelism measurement shall exclude any effect of mark on top surface of package.

5.

14x14 array

Ironwood Package Code: BGA196E

DIM

Minimum

Maximum

A

2.5

A1

0.17

0.37

b

0.50

D

12.0 BSC

E

12.0 BSC

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: BGA Spec

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. E

DATE: 05/11/09

Material: Material <not specified>

Finish: -

Weight: 13.20

SBT-BGA-6504 Drawing

SCALE: 2:1

SHEET: 3 OF 5

ENG: V. Panavala

FILE: SBT-BGA-6504

DRAWN BY: V. Panavala