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LM6321 Folha de dados(PDF) 7 Page - National Semiconductor (TI) |
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LM6321 Folha de dados(HTML) 7 Page - National Semiconductor (TI) |
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7 / 10 page ![]() Application Hints (Continued) The heatsink for the LM6321 is made using the PC board copper. The heat is conducted from the die, through the lead frame (inside the part), and out the pins which are soldered to the PC board. The pins used for heat conduction are: TABLE 1. Part Package Pins LM6321N 8-Pin DIP 1, 4, 5, 8 LM6321M 14-Pin SO 1, 2, 3, 6, 7, 8, 9, 13, 14 Figure 3 shows copper patterns which may be used to dissi- pate heat from the LM6321. TABLE 2. Package L (in.) H (in.) θ J–A (˚C/W) 8-Pin DIP 2 0.5 47 14-Pin SO 1 0.5 69 21 57 Table 2 shows some values of junction-to-ambient thermal resistance ( θ J–A) for values of L and W for 2 oz. copper: 8-Pin DIP DS009223-9 14-Pin SO DS009223-10 *For best results, use L = 2H FIGURE 3. Copper Heatsink Patterns www.national.com 7 |
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