Data Sheet

HMC558A

Rev. 0 | Page 15 of 15

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

SIDE VIEW

SEATING

PLANE

0.92 MAX

1

4

6

7

9

10

12

3

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.36

0.30

0.24

PIN 1

EXPOSED

PAD

PIN 1

INDICATOR

3.13

3.00 SQ

2.87

2.10 BSC

1.00 REF

1.60

1.50 SQ

1.40

Figure 36. 12-Terminal Ceramic Leadless Chip Carrier [LCC]

(E-12-1)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature

Range

Description

Package

Option

Package Body

Material

Lead

Finish

MSL

Rating

Branding

HMC558ALC3B

−40°C to +85°C

12-Terminal Ceramic

Leadless Chip Carrier [LCC]

E-12-1

Alumina

Ceramic

Gold over

Nickel

MSL3

H558A

XXXX

HMC558ALC3BTR

−40°C to +85°C

12-Terminal Ceramic

Leadless Chip Carrier [LCC]

E-12-1

Alumina

Ceramic

Gold over

Nickel

MSL3

H558A

XXXX

HMC558ALC3BTR-R5

−40°C to +85°C

12-Terminal Ceramic

Leadless Chip Carrier [LCC]

E-12-1

Alumina

Ceramic

Gold over

Nickel

MSL3

H558A

XXXX

EV1HMC558ALC3B

Evaluation PCB Assembly

©2016 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D15000-0-11/16(0)