All tolerances: ±0.125mm (unless stated

otherwise). Materials and specifications

are subject to change without notice.

SBT BGA Socket - Direct mount, solderless

High speed, reliable SBT Pin connection

Compression plate distributes forces evenly

Minimum real estate required

Features

Directly mounts to target PCB (needs tooling holes) with hardware.

Top View:

(fan removed)

Side View

(Section AA)

Easily removable swivel socket lid

45.00mm

45.00mm

A

A

Fan is not shown

Status: Released

Drawing: E Smolentseva

Scale: -

Rev: A

Date: 09/08/2012

Modified:

File: SBT-BGA-6019 Dwg.mcd

SBT-BGA-6019 Drawing

PAGE 1 of 4

© 2010 IRONWOOD ELECTRONICS, INC.

Tele: (952) 229-8200

www.ironwoodelectronics.com

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Customer's Target PCB

Customer's

BGA IC

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Socket Lid/ Heat sink: Ni plated Aluminum.

Socket base screw: Socket head cap, alloy steel with

black oxide finish, 0-80 fine thread , 15.875mm long.

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Socket base: Ni plated Aluminum.

Thickness = 5mm.

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Insulation Plate: FR4, Thickness = 1.59mm.

Compression screw: Socket head cap, alloy steel with

black oxide finish, 0-80 fine thread , 7.94mm long.

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Backing Plate: Ni plated Aluminum.

Thickness = 4mm.

IC Frame: Ultem

Pin Guide: Ceramic Filled Peek

SBT pin: Stamped contact BeCu, Au plated

Spring: SS, Au plated

Gap Pad

Fan: 40x40x10mm

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Recommended torque is

1 in lb per screw

Remove fan prior to

Applying torque to

Heat sink / compression

plate