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SPH Folha de dados(PDF) 2 Page - TT Electronics.

Nome de Peças SPH
Descrição Electrónicos  Drop-in replacement for BWH/BWF
PDF  4 Pages
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Fabricante Electrônico  TTELEC [TT Electronics.]
Página de início  http://www.ttelectronics.com/
Logo TTELEC - TT Electronics.

SPH Folha de dados(HTML) 2 Page - TT Electronics.

  SPH Datasheet HTML 1Page - TT Electronics. SPH Datasheet HTML 2Page - TT Electronics. SPH Datasheet HTML 3Page - TT Electronics. SPH Datasheet HTML 4Page - TT Electronics.  
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General-Purpose Failsafe
Moulded Wirewound Resistors
SPH/SPF Series
Make Possible
07.14
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
www.ttelectronicsresistors.com
General Purpose Failsafe
Molded Wirewound Resistor
SPH/SPF Series
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
© TT electronics plc
01.14
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Wire and Film Technologies Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Dimensions (Inches and (mm))
Type
A
B
C
D
SPH
0.562 ± 0.010
(14.3 ± 0.25)
0.225 ± 0.008
(5.72 ± 0.20)
0.032 ± 0.002
(0.813 ± 0.05)
1.50 ± 0.126
(38.1 ± 3.2)
SPF
0.562 ± 0.010
(14.3 ± 0.25)
0.225 ± 0.008
(5.72 ± 0.20)
0.032 ± 0.002
(0.813 ± 0.05)
1.50 ± 0.126
(38.1 ± 3.2)
Physical Data
C
D
A
B
General Purpose Failsafe
Molded Wirewound Resistor
Environmental Data
Test
SPH
SPF
Temperature Coefficient (ppm)*
0.1
Ω - 0.16Ω ± 1000
0.18
Ω - 0.68Ω ± 800
0.75
Ω - 2400Ω ± 400
0.10
Ω ± 1700
0.11
Ω - 0.16Ω ± 1000
0.18
Ω - 0.68Ω ± 800
0.75
Ω - 1000Ω ± 400
Dielectric Withstanding Voltage (RMS)
1000V
1000V
Momentary Overload
5%
5%
Low Temperature Operation
5%
5%
Temperature Cycle
5%
5%
Humidity
5%
5%
Load Life
5%
5%
Terminal Strength
5%
5%
Resistance to Solder Heat
5%
5%
Solderability
No Failures
No Failures
SPH/SPF Series Issue December 2008 Sheet 2 of 3



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