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LR1812G-XX-AF5-R Folha de dados(PDF) 5 Page - Unisonic Technologies

Nome de Peças LR1812G-XX-AF5-R
Descrição Electrónicos  Low Dropout Voltage
PDF  6 Pages
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Fabricante Electrônico  UTC [Unisonic Technologies]
Página de início  http://www.utc-ic.com
Logo UTC - Unisonic Technologies

LR1812G-XX-AF5-R Folha de dados(HTML) 5 Page - Unisonic Technologies

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LR1812
CMOS IC
UNISONICTECHNOLOGIESCO.,LTD
5 of 6
www.unisonic.com.tw
QW-R102-079.a
ELECTRICAL CHARACTERISTICS (Cont.)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ON/OFF Pin Input Voltage “H”
VSH
1.5
ON/OFF Pin Input Voltage “L”
VSL
VIN=VOUT(S)+1V, RL=1.0KΩ
Determinied by VOUT output level
0.3
V
ON/OFF Pin Input Current “H”
ISH
VIN=VOUT(S)+1V,VON/OFF=5.5V
-0.1
0.1
uA
ON/OFF Pin Input Current “L”
ISL
VIN=VOUT(S)+1V,VON/OFF=0V
-0.1
0.1
uA
Reverse Current(Note 8)
IREV
VIN=0V, VOUT= 6.0V
0.1
1.5
uA
VOUT Pin Sink Current
(Note 9)
IREVS
VIN=5.0V, VOUT=6.0V
0.1
1.5
uA
1.2V≤VOUT(S)<3.0V
65
3.0V≤VOUT(S) ≤3.5V
60
Ripple Rejection
|RR|
VIN=VOUT(S)+1V,
f=1khz,
△
Vrip=0.5Vrms,
IOUT=100mA
3.5V≤VOUT(S) ≤5.0V
55
dB
Thermal Shutdown detection
temperature
TSD
Junction temperature
150
°C
Thermal Shutdown release
temperature
TSR
Junction temperature
120
°C
Notes: 1. The UTC LR1812 output must be diode-clamped to ground. If used in a dual-supply system where the
regulator load is returned to a negative supply.
2. Devices must be derated based on package thermal resistance at elevated temperatures.
3. VOUT(S): Specified output voltage
VOUT(E): Actual output voltage
Output voltage when fixing IOUT(=100ma) and inputting VOUT(S)+1.0V
4. Vdrop=VIN1-(VOUT3×0.98)
VOUT3 is the output voltage when VIN=VOUT(S)+1.0V and IOUT=300mA, 1000mA.
5. The output current at which the output voltage becomes 95% of VOUT(E) after gradually increasing the
output current.
6. The change in temperature [mV/°C] is calculated using the following equation.
()
/
/
1000
OUT
OUT
OUT S
AA
OUT
VV
mV
C
V
V
ppm
C
TT
V



 

 
 
7. The output current can be at least this value.
Due to restrictions on the package power dissipation, this value may not be satisfied. Attention should be
paid to the power dissipation of the package when the output current is large.
This specification is guaranteed by design.
8. Reverse current (IREV) flows from VOUT to VIN.
9. VOUT pin sink current (IREVS) flows from VOUT to GND.



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