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LM3876TF Folha de dados(PDF) 11 Page - National Semiconductor (TI) |
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LM3876TF Folha de dados(HTML) 11 Page - National Semiconductor (TI) |
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11 / 19 page ![]() Typical Performance Characteristics (Continued) Application Information GENERAL FEATURES Mute Function: The muting function of the LM3876 allows the user to mute the music going into the amplifier by draw- ing less than 0.5 mA out of pin 8 of the device. This is accom- plished as shown in the Typical Application Circuit where the resistor R M is chosen with reference to your negative supply voltage and is used in conjuction with a switch. The switch (when opened) cuts off the current flow from pin 8 to V −, thus placing the LM3876 into mute mode. Refer to the Mute At- tenuation vs Mute Current curves in the Typical Perfor- mance Characteristics section for values of attenuation per current out of pin 8. The resistance R M is calculated by the following equation: R M (|VEE| − 2.6V)/I8 where I8 ≥ 0.5 mA. Under-Voltage Protection: Upon system power-up the under-voltage protection circuitry allows the power supplies and their corresponding caps to come up close to their full values before turning on the LM3876 such that no DC output spikes occur. Upon turn-off, the output of the LM3876 is brought to ground before the power supplies such that no transients occur at power-down. Over-Voltage Protection: The LM3876 contains overvolt- age protection circuitry that limits the output current to ap- proximately 6Apeak while also providing voltage clamping, though not through internal clamping diodes. The clamping effect is quite the same, however, the output transistors are designed to work alternately by sinking large current spikes. SPiKe Protection: The LM3876 is protected from instanta- neous peak-temperature stressing by the power transistor array. The Safe Operating Area graph in the Typical Perfor- mance Characteristics section shows the area of device operation where the SPiKe Protection Circuitry is not en- abled. The waveform to the right of the SOA graph exempli- fies how the dynamic protection will cause waveform distor- tion when enabled. Thermal Protection: The LM3876 has a sophisticated ther- mal protection scheme to prevent long-term thermal stress to the device. When the temperature on the die reaches 165˚C, the LM3876 shuts down. It starts operating again when the die temperature drops to about 155˚C, but if the temperature again begins to rise, shutdown will occur again at 165˚C. Therefore the device is allowed to heat up to a relatively high temperature if the fault condition is temporary, but a sustained fault will cause the device to cycle in a Schmitt Trigger fashion between the thermal shutdown tem- perature limits of 165˚C and 155˚C. This greatly reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions. Since the die temperature is directly dependent upon the heat sink, the heat sink should be chosen as discussed in the Thermal Considerations section, such that thermal shutdown will not be reached during normal operation. Using the best heat sink possible within the cost and space con- straints of the system will improve the long-term reliability of any power semiconductor device. Mute Attenuation vs Mute Current DS011832-44 Mute Attenuation vs Mute Current DS011832-45 Large Signal Response DS011832-46 Power Supply Rejection Ratio DS011832-47 Common-Mode Rejection Ratio DS011832-48 Open Loop Frequency Response DS011832-49 www.national.com 11 |
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