Os motores de busca de Datasheet de Componentes eletrônicos
  Portuguese  ▼
ALLDATASHEETPT.COM

X  

LM3876TF Folha de dados(PDF) 11 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Nome de Peças LM3876TF
Descrição Electrónicos  LM3876 Overture??Audio Power Amplifier Series High-Performance 56W Audio Power Amplifier w/Mute
PDF  19 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricante Electrônico  NSC [National Semiconductor (TI)]
Página de início  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM3876TF Folha de dados(HTML) 11 Page - National Semiconductor (TI)

Back Button LM3876TF Datasheet HTML 7Page - National Semiconductor (TI) LM3876TF Datasheet HTML 8Page - National Semiconductor (TI) LM3876TF Datasheet HTML 9Page - National Semiconductor (TI) LM3876TF Datasheet HTML 10Page - National Semiconductor (TI) LM3876TF Datasheet HTML 11Page - National Semiconductor (TI) LM3876TF Datasheet HTML 12Page - National Semiconductor (TI) LM3876TF Datasheet HTML 13Page - National Semiconductor (TI) LM3876TF Datasheet HTML 14Page - National Semiconductor (TI) LM3876TF Datasheet HTML 15Page - National Semiconductor (TI) Next Button
Zoom Inzoom in Zoom Outzoom out
 11 / 19 page
background image
Typical Performance Characteristics (Continued)
Application Information
GENERAL FEATURES
Mute Function: The muting function of the LM3876 allows
the user to mute the music going into the amplifier by draw-
ing less than 0.5 mA out of pin 8 of the device. This is accom-
plished as shown in the Typical Application Circuit where the
resistor R
M is chosen with reference to your negative supply
voltage and is used in conjuction with a switch. The switch
(when opened) cuts off the current flow from pin 8 to V
, thus
placing the LM3876 into mute mode. Refer to the Mute At-
tenuation vs Mute Current curves in the Typical Perfor-
mance Characteristics section for values of attenuation per
current out of pin 8. The resistance R
M is calculated by the
following equation:
R
M (|VEE| − 2.6V)/I8 where I8 ≥ 0.5 mA.
Under-Voltage Protection: Upon system power-up the
under-voltage protection circuitry allows the power supplies
and their corresponding caps to come up close to their full
values before turning on the LM3876 such that no DC output
spikes occur. Upon turn-off, the output of the LM3876 is
brought to ground before the power supplies such that no
transients occur at power-down.
Over-Voltage Protection: The LM3876 contains overvolt-
age protection circuitry that limits the output current to ap-
proximately 6Apeak while also providing voltage clamping,
though not through internal clamping diodes. The clamping
effect is quite the same, however, the output transistors are
designed to work alternately by sinking large current spikes.
SPiKe Protection: The LM3876 is protected from instanta-
neous peak-temperature stressing by the power transistor
array. The Safe Operating Area graph in the Typical Perfor-
mance Characteristics section shows the area of device
operation where the SPiKe Protection Circuitry is not en-
abled. The waveform to the right of the SOA graph exempli-
fies how the dynamic protection will cause waveform distor-
tion when enabled.
Thermal Protection: The LM3876 has a sophisticated ther-
mal protection scheme to prevent long-term thermal stress
to the device. When the temperature on the die reaches
165˚C, the LM3876 shuts down. It starts operating again
when the die temperature drops to about 155˚C, but if the
temperature again begins to rise, shutdown will occur again
at 165˚C. Therefore the device is allowed to heat up to a
relatively high temperature if the fault condition is temporary,
but a sustained fault will cause the device to cycle in a
Schmitt Trigger fashion between the thermal shutdown tem-
perature limits of 165˚C and 155˚C. This greatly reduces the
stress imposed on the IC by thermal cycling, which in turn
improves its reliability under sustained fault conditions.
Since the die temperature is directly dependent upon the
heat sink, the heat sink should be chosen as discussed in
the Thermal Considerations section, such that thermal
shutdown will not be reached during normal operation. Using
the best heat sink possible within the cost and space con-
straints of the system will improve the long-term reliability of
any power semiconductor device.
Mute Attenuation vs
Mute Current
DS011832-44
Mute Attenuation vs
Mute Current
DS011832-45
Large Signal Response
DS011832-46
Power Supply
Rejection Ratio
DS011832-47
Common-Mode
Rejection Ratio
DS011832-48
Open Loop
Frequency Response
DS011832-49
www.national.com
11



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19


Folha de dados Download

Go To PDF Page


Ligação URL



ALLDATASHEET é útil para você?  [ DONATE ] 

Sobre Alldatasheet   |   Publicidade   |   Contato conosco   |   Privacy Policy   |   Link para a ficha técnica    |   roca de Link   |   Lista de Fabricantes
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com