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MLX90363 Folha de dados(PDF) 4 Page - Melexis Microelectronic Systems

Nome de Peças MLX90363
Descrição Electrónicos  Triaxis짰 Magnetometer IC With High Speed Serial Interface
PDF  57 Pages
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Fabricante Electrônico  MELEXIS [Melexis Microelectronic Systems]
Página de início  http://www.melexis.com
Logo MELEXIS - Melexis Microelectronic Systems

MLX90363 Folha de dados(HTML) 4 Page - Melexis Microelectronic Systems

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MLX90363
Triaxis® Magnetometer IC
With High Speed Serial Interface
3901090363
Page 4 of 57
Data Sheet
Rev. 005
Jul/13
17. MLX90363 DESCRIPTION OF END-USER PROGRAMMABLE ITEMS ........................................... 39
17.1.
USER CONFIGURATION: DEVICE ORIENTATION.........................................................................................39
17.2.
USER CONFIGURATION: MAGNETIC ANGLE FORMULA .............................................................................39
17.3.
USER CONFIGURATION: 3D=0 FORMULA TRIMMING PARAMETERS SMISM AND ORTH_B1B2 ...............39
17.3.1.
Magnetic Angle
∠XY............................................................................................................................39
17.3.2.
Magnetic Angle
∠XZ and ∠YZ ............................................................................................................40
17.4.
USER CONFIGURATION: 3D=1 FORMULA TRIMMING PARAMETERS KALPHA, KBETA, KT ....................40
17.5.
USER CONFIGURATION: FILTER ................................................................................................................41
17.6.
VIRTUAL GAIN MIN AND MAX PARAMETERS ...........................................................................................41
17.7.
HYSTERESIS FILTER ................................................................................................................................42
17.8.
EMC FILTER ON SCI PINS.........................................................................................................................42
17.9.
IDENTIFICATION & FREE BYTES...............................................................................................................42
17.10.
LOCK.........................................................................................................................................................42
18. MLX90363 SELF DIAGNOSTIC.......................................................................................................... 43
19. MLX90363 FIRMWARE FLOWCHARTS ............................................................................................ 44
19.1.
START-UP SEQUENCE ................................................................................................................................44
19.2.
SIGNAL PROCESSING (GETX) ...................................................................................................................45
19.3.
FAIL-SAFE MODE ......................................................................................................................................45
19.4.
AUTOMATIC GAIN CONTROL ....................................................................................................................46
20. RECOMMENDED APPLICATION DIAGRAMS .................................................................................. 47
20.1.
MLX90363 IN SOIC-8 PACKAGE AND 5V APPLICATION DIAGRAMS........................................................47
20.2.
MLX90363 IN SOIC-8 PACKAGE AND 3V3 APPLICATION DIAGRAMS......................................................47
20.3.
MLX90363 IN TSSOP-16 PACKAGE AND 5V APPLICATION DIAGRAMS...................................................48
20.4.
MLX90363 IN TSSOP-16 PACKAGE AND 3V3 APPLICATION DIAGRAMS.................................................49
21. STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS
WITH DIFFERENT SOLDERING PROCESSES ........................................................................................ 50
22. ESD PRECAUTIONS........................................................................................................................... 50
23. PACKAGE INFORMATION................................................................................................................. 51
23.1.
SOIC8 – PACKAGE DIMENSIONS...............................................................................................................51
23.2.
SOIC8 – PINOUT AND MARKING...............................................................................................................52
23.3.
SOIC8 – IMC POSITIONNING ....................................................................................................................53
23.4.
TSSOP16 – PACKAGE DIMENSIONS..........................................................................................................54
23.5.
TSSOP16 – PINOUT AND MARKING..........................................................................................................55
23.6.
TSSOP16 – IMC POSITIONNING ...............................................................................................................55
24. DISCLAIMER ....................................................................................................................................... 57



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