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M95M02-DR Folha de dados(PDF) 39 Page - STMicroelectronics |
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M95M02-DR Folha de dados(HTML) 39 Page - STMicroelectronics |
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39 / 45 page ![]() DocID18203 Rev 10 39/45 M95M02-DR Package information 44 10.2 WLCSP package information Figure 25. WLCSP- 8-bump, 3.556 x 2.011 mm, wafer level chip scale package outline 1. Drawing is not to scale. 2. Primary datum Z and seating plane are defined by the spherical crowns of the bump. Table 17. WLCSP- 8-bump, 3.556 x 2.011 mm, wafer level chip scale package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.500 0.540 0.580 0.0197 0.0213 0.0228 A1 - 0.190 - - 0.0075 - A2 - 0.350 - - 0.0138 - b(2) - 0.270 - - 0.0106 - D - 3.556 3.576 - 0.1400 0.1408 E - 2.011 2.031 - 0.0792 0.0800 e - 1.000 - - 0.0394 - e1 - 1.200 - - 0.0472 - e2 - 2.100 - - 0.0827 - F - 0.505 - - 0.0199 - G - 0.500 - - 0.0197 - H - 0.728 - - 0.0287 - J - 0.200 - - 0.0079 - |
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