SH-7010MB datasheet(3/6 Pages) COPAL

3 / 6 page

SH-7000

ROTARY CODED SWITCHES (SMD)

No. of positions

Adjustment torque

Stepping angle

Solderability

Shear (adhesion)

Substrate bending

Pull-off strength

10, 16

3 ~ 20 mN·m { 3~ 204 gf·cm} maximum

36° (10 positions)

22.5° (16 positions)

245

± 3 °C, 2 ~ 3 s

5 N {0.51 kgf} 10 s

Manual soldering

：

350

± 10 °C, 3 ~ 4 s

Width 90 mm, bend 3 mm, 5 s, 1 time

5 N {0.51 kgf} 10s

Vibration

Shock

Load life

Humidity

High temperature exposure

Low temperature exposure

Thermal shock

(Amplitude) 1.5 mm or

(Acceleration) 98 m/s

10-500-10 Hz, 3 directions for 2 h each

490 m/s

2, 11 ms

6 directions for 3 times each

10000 steps minimum, DC5 V, 100 mA

85 °C, 96 h

105 °C, 96 h (Gray code)

40 °C, Relative humidity 90 ~ 95 %,

240 h

−40 °C, 96 h

−40 (0.5 h) ~ 85 °C ( 0.5 h ), 5 cycles

−40 (0.5 h) ~ 105 °C ( 0.5 h ), 5 cycles (Gray code)

■ MECHANICAL CHARACTERISTICS

■ ENVIRONMENTAL CHARACTERISTICS

〈Reflow profile for soldering heat evaluation〉

Reflow : two times maximum

Peak : 250

Over 230 C

Pre Heating Zone

180 C

(C)

250

200

150

100

150 C

90 30 s

30 10 s

Soldering Zone

Heating time

Soldering heat

Flow : 260

± 3 °C as the temperature in

a pot of molten solder, immersion

from head of terminal to backside

of board,5 ~ 6 s, two times

maximum

Reflow

：255 °C (Peak temperature)

Reflow : Peak temperature 255 °C

(Please refer to the profile below.)

■ OUTLINE DIMENSIONS

Unless otherwise specified, tolerance:

± 0.3 (Unit: mm)

O SH-7010A (Real code)

O SH-7030A (Complementary code)

O SH-7010B (Real code)

O SH-7030B (Complementary code)

7.3

0.7 W

× 2.8 L × 1 D

Marking appears only with complementary code

⑧

Ⓒ

②

①

Ⓒ

④

Production date code

6 – 0.6

t = 0.15

3.75

2.54

7.3

0.7 W

× 2.8 L × 1D

Production date code

Marking appears only with complementary code

①

Ⓒ

④

⑧

Ⓒ

②

3.75

6 – 0.6

t = 0.15

2.54

{ } : Reference only

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