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HDF110M4S21 Folha de dados(PDF) 6 Page - Shoulder Electronics Limited.

Nome de Peças HDF110M4S21
Descrição Electrónicos  This specification shall cover the characteristics of SAW filter With 110M used for IF applications.
PDF  9 Pages
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Fabricante Electrônico  SHOULDER [Shoulder Electronics Limited.]
Página de início  http://www.shoulder.cn/
Logo SHOULDER - Shoulder Electronics Limited.

HDF110M4S21 Folha de dados(HTML) 6 Page - Shoulder Electronics Limited.

  HDF110M4S21 Datasheet HTML 1Page - Shoulder Electronics Limited. HDF110M4S21 Datasheet HTML 2Page - Shoulder Electronics Limited. HDF110M4S21 Datasheet HTML 3Page - Shoulder Electronics Limited. HDF110M4S21 Datasheet HTML 4Page - Shoulder Electronics Limited. HDF110M4S21 Datasheet HTML 5Page - Shoulder Electronics Limited. HDF110M4S21 Datasheet HTML 6Page - Shoulder Electronics Limited. HDF110M4S21 Datasheet HTML 7Page - Shoulder Electronics Limited. HDF110M4S21 Datasheet HTML 8Page - Shoulder Electronics Limited. HDF110M4S21 Datasheet HTML 9Page - Shoulder Electronics Limited.  
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SAW FILTER
HDF110M4
SMD-21
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 6 of 9
5. ENVIRONMENTAL CHARACTERISTICS
5-1 Temperature cycling
Subject the device to a low temperature of -40℃ for 30 minutes. Following by a
high temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30
Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the
measurement. It shall meet the specifications in 2-1.
5-2 Resistance to solder heat
Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1 sec.
Then release the device into the room conditions for 4 hours. It shall meet the specifications
in 2-1.
5-3 Solderability
Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than
95% area of the soldering pad must be covered with new solder. It shall meet the
specifications in 2-1.
5-4 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the
filter shall fulfill the specifications in 2-1.
5-5 Vibration
Subject the device to the vibration for 2 hour each in x,y and z axes with the
amplitude of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in 2-1.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
7. Packing
7.1 Dimensions
(1) Carrier Tape: Figure 1
(2) Reel: Figure 2
(3) The product shall be packed properly not to be damaged during transportation and storage.



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