10H116 datasheet(3/5 Pages) ONSEMI

3 / 5 page

MC10H116

www.onsemi.com

PACKAGE DIMENSIONS

20 LEAD PLLC

CASE 775−02

ISSUE F

−M−

−N−

−L−

Y BRK

L-M

0.007 (0.180)

N S

L-M

0.007 (0.180)

N S

L-M

0.010 (0.250)

N S

VIEW D−D

L-M

0.007 (0.180)

N S

L-M

0.007 (0.180)

N S

L-M

0.010 (0.250)

N S

VIEW S

0.004 (0.100)

−T− SEATING

PLANE

L-M

0.007 (0.180)

N S

L-M

0.007 (0.180)

N S

VIEW S

NOTES:

1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,

1982.

2. DIMENSIONS IN INCHES.

3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP

OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD

PARTING LINE.

4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT

DATUM −T−, SEATING PLANE.

5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.

ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.

6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER

THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).

DIMENSIONS R AND U ARE DETERMINED AT THE

OUTERMOST EXTREMES OF THE PLASTIC BODY

EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE

BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY

MISMATCH BETWEEN THE TOP AND BOTTOM OF THE

PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR

PROTRUSION OR INTRUSION. THE DAMBAR

PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION

TO BE GREATER THAN 0.037 (0.940). THE DAMBAR

INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO

BE SMALLER THAN 0.025 (0.635).

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

0.385

0.395

9.78

10.03

0.385

0.395

9.78

10.03

0.165

0.180

4.20

4.57

0.090

0.110

2.29

2.79

0.013

0.021

0.33

0.53

0.050 BSC

1.27 BSC

0.026

0.032

0.66

0.81

0.020

−−−

0.51

−−−

0.025

−−−

0.64

−−−

0.350

0.356

8.89

9.04

0.350

0.356

8.89

9.04

0.042

0.048

1.07

1.21

0.042

0.048

1.07

1.21

0.042

0.056

1.07

1.42

−−−

0.020

−−−

0.50

0.310

0.330

7.88

8.38

0.040

−−−

1.02

−−−

____

10H116 Folha de dados(PDF) 3 Page - ON Semiconductor

10H116 Folha de dados(HTML) 3 Page - ON Semiconductor

Html Pages

1 2 3 4 5

Folha de dados Download

Ligação URL