UCD3138RHAR datasheet(71/89 Pages) TI1

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UCD3138

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SLUSAP2G – MARCH 2012 – REVISED SEPTEMBER 2016

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Mechanical Packaging and Orderable Information

10.2 Documentation Support

For related documentation see the following:

10.2.1 References

1. UCD3138 Digital Power Peripherals Programmer’s Manual (SLUU995)

2. UCD3138 Monitoring and Communications Programmer’s Manual (SLUU996)

3. UCD3138 ARM and Digital System Programmer’s Manual (SLUU994)

4. FUSION_DIGITAL_POWER_DESIGNER for Isolated Power Applications (SLUA676)

5. Code Composer Studio Development Tools v3.3 – Getting Started Guide (SPRU509)

6. ARM7TDMI-S Technical Reference Manual

7. System Management Bus (SMBus) Specification

8. PMBus™ Power System Management Protocol Specification

10.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the

upper right corner, click on Alert me to register and receive a weekly digest of any product information that

has changed. For change details, review the revision history included in any revised document.

10.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the

respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;

see TI's Terms of Use.

TI E2E™ Online Community The TI engineer-ro-engineer (E2E) community was created to foster

collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,

explore ideas and help solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools

and contact information for technical support.

10.5 Trademarks

E2E is a trademark of Texas Instruments.

ARM7TDMI-S is a trademark of ARM.

PMBus is a trademark of SMIF, Inc..

All other trademarks are the property of their respective owners.

10.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

10.7 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

11 Mechanical Packaging and Orderable Information

11.1 Packaging Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and

revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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