ADV7181BCP datasheet(94/96 Pages) AD

94 / 96 page

ADV7181B

Rev. 0 | Page 94 of 96

OUTLINE DIMENSIONS

*COMPLIANT TO JEDEC STANDARDS MO-220-VMMD

EXCEPT FOR EXPOSED PAD DIMENSION

PIN 1

INDICATOR

TOP

VIEW

8.75

BSC SQ

9.00

BSC SQ

0.45

0.40

0.35

0.30

0.25

0.18

7.50

REF

0.60 MAX

7.25

7.10 SQ*

6.95

PIN 1

INDICATOR

0.25 MIN

0.50 BSC

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

0.05 MAX

0.02 NOM

SEATING

PLANE

EXPOSED PAD

(BOTTOM VIEW)

Figure 45. 64-Lead Lead Frame Chip Scale Package [LFCSP]

9 mm × 9 mm Body

(CP-64-3)

Dimensions shown in millimeters

TOP VIEW

(PINS DOWN)

0.27

0.22

0.17

0.50

BSC

10.00

BSC SQ

1.60

MAX

SEATING

PLANE

0.75

0.60

0.45

VIEW A

12.00

BSC SQ

0.20

0.09

1.45

1.40

1.35

0.08 MAX

COPLANARITY

VIEW A

ROTATED 90° CCW

SEATING

PLANE

10°

6°

2°

7°

3.5°

0°

0.15

0.05

PIN 1

COMPLIANT TO JEDEC STANDARDS MS-026BCD

Figure 46. 64-Lead Low Profile Quad Flat Package [LQFP]

(ST-64-2)

Dimensions shown in Millimeters

Note that the exposed metal paddle on the bottom of the LFCSP package must be soldered to PCB ground for proper heat dissipation and

also for noise and mechanical strength benefits.

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