8

3M EMI/EMC Solutions

specialized electronics assembly operations – from attaching EMI shields and gaskets to grounding and bonding

flexible circuits and PCBs – while improving the performance and reliability of your finished products.

3M ECATT General Overview Comparative Reference Table

ECATT Basic Comparative Reference Table:

Based on the suggested “ECATT Selection

Process”, the end user should identify 2-4

ECATT products to test in an application

to determine fitness for use. As each

application is unique, it is difficult to identify

the “Optimum” ECATT product without testing

the ECATT products in an end use assembly

design. The ECATT Selection Process of

“Good-Better-Best” ranks products as they

might perform in a nominal application. As

each ECATT may employ different conductive

particles, scrim or non-woven, thickness

variations, acrylic adhesive type, etc., they

will perform differently based on end use

application – hence the need for the end

users’ own comparative testing. The following

technical information and data should be

considered representative or typical and should

not be used for specification purposes.

Contact Resistance

(R ohms) between a

Copper foil test panel and

a 2nd Sheet of a Copper

foil test panel using the

3M ECATT

Contact Resistance

(R ohms) between a

Gold Flexible

Test Strip and a Gold

Pad PCB panel

using the 3M ECATT

Adhesive Type

Features,

Advantages, and Benefits

Copper foil bonded to

a Copper Foil using the

3M ECATT / 3M 2-point

Resistance Test Method /

Area / 1 hour RT Dwell.

See note 1.

Gold flex bonded to

PCB gold test pad.

contact area.

1 hour RT Dwell.

See note 1.

9703

50

Z

Silver

Low Outgassing

Acrylic ECATT

Z- Axis, Low outgassing

< 0.2

< 0.2

9704

50

Z

Silver

Low Outgassing

Acrylic ECATT

Z-axis, High adhesion, Low outgassing

< 0.2

< 0.2

9705

50

Z

Silver

Standard

Acrylic ECATT

Z-Axis, Standard outgassing version of 9703

< 0.2

< 0.2

9706

50

Z

Silver

High Adhesion

Acrylic ECATT

High adhesion version of the 9705

< 0.2

< 0.3

9707

9707

50

XYZ

Silver

High Adhesion

Acrylic ECATT

High adhesion, “Bond Line Gap/Slit”

EMI shielding for High Frequency,

Low contact R to SS

< 0.2

< 0.3

9709

50

XYZ

Silver

Standard

Acrylic ECATT

Standard adhesion, “Bond Line Gap/Slit”

EMI shielding for High Frequency

< 0.2

< 0.3

9709S

50

XYZ

Silver

Standard

Acrylic ECATT

Standard adhesion, “Bond Line Gap/Slit”

EMI shielding for High Frequency,

Low contact R to SS

< 0.2

< 0.2

9709SL

50

XYZ

Silver

Standard

Acrylic ECATT

Premium low liner release version of 9709S

< 0.2

< 0.2

7805

150

XYZ

Silver

Standard

Acrylic ECATT

Thicker ECATT for gap filling

< 1.0

< 0.2

7850

150

XYZ

Carbon

High Adhesion

Acrylic ECATT

Higher thermal conductivity

& Thicker ECATT for gap filling

< 1.0

< 10.0

7772

66

XYZ

Nickle &

Alum DC

Medium Adhesion

Acrylic D/C

Double coated aluminum foil

< 0.5

< 2.0

9712

125

XYZ

Carbon

Standard Acrylic

ECATT

Non-woven conductive scrim

& Standard acrylic adhesive

< 1.5

< 15.0

9713

89

XYZ

Nickel/C

Standard

Acrylic ECATT

Lower R non-woven conductive scrim vs.

9712 & Standard acrylic adhesive

< 0.4

< 7.5

9719

100

XYZ

Nickel/C

Silicone ECATT

Low surface energy silicone adhesive, Higher

temperature resistance, Lower R non-woven

conductive scrim vs. 9712

< 1.0

< 20.0

9720S

30

XYZ

Nickel/Cu

High Adhesion

Acrylic ECATT

Lower R non-woven conductive scrim vs. 9713,

Thinner scrim design

& Medium adhesion

< 0.2

< 0.5

9723

60

XYZ

Nickel/Cu

High Adhesion

Acrylic ECATT

Lower R non-woven conductive scrim vs.

9713, Thinner scrim design & High adhesion

< 0.2

< 0.4

9750

50

XYZ

Nickel/Cu

High Adhesion

Acrylic ECATT

Lower R non-woven conductive scrim

vs. 9713 & High adhesion

< 0.2

< 0.5

9732

100

XYZ

Nickel/Cu

Medium Adhesion

Acrylic ECATT

Lower R non-woven conductive scrim vs. 9713,

Thicker scrim design & High adhesion

< 0.2

< 2.5

9760

50

XYZ

Nickel/Cu

High / Low Adhesion

Double sided reworkable

Acrylic ECATT

Easier rework as greater Face Side to Back Side

adhesion delta. Easier rework version

of 9725. High and Low adhesion sides.

< 0.2

< 0.8

9764

150

XYZ

Nickel/Cu

High / Low Adhesion

Double sided reworkable

Acrylic ECATT

Easier rework as greater Face Side to Back Side

adhesion delta. Easier rework and thicker version

of 9732. High and Low adhesion sides.

< 0.5

< 5.0

9780

200

XYZ

Nickel/Cu

High / Low Adhesion

Double sided reworkable

Acrylic ECATT

Easier rework as greater Face Side to Back Side

adhesion delta. Easier rework and thicker version

of 9732. High and Low adhesion sides.

< 0.5

< 5.0

Note 1: Test & performance results will vary

based on items such as, but are not

limited to: Contact area; Assembly

method; Testing conditions; Normal

variations in product performance

from one mfg. lot to a different mfg.

lot of material – along with the normal

variations found in a material within

a mfg. lot (i.e., thickness, available

conductive material in an actual sample

tested, variations in conductive filler

materials and uniformity of conductive

materials dispersed within a lot of

material, variations in adhesives, etc.);

Test methods; Environmental aging; Exact

test surface material type utilized, etc.

The “Copper to Copper” & “Gold Flex to

PCB” testing also should be noted for the

differences related to the “Contact area”

results. Testing of ECATT materials and

the noted test substrates does not imply

that the ECATT is suitable for an end use

application of similar materials. End user

is responsible to determine if an ECATT

and substrate combination is fit for use in

their intended end use application.

Note 2: More ECATT options are available. Chart

references typical type options. Contact

your 3M Technical Service Representative

for more details.